Circuit substrate, chip, series circuit, circuit board and electronic device
US11758654B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 28, 2019 |
| Grant date | Sep 12, 2023 |
| Priority date | — |
| Expiry date | Sep 21, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/094
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention discloses a circuit substrate including an insulation layer; a metal layer disposed on a first surface of the insulation layer; and a first solder pad and a second solder pad disposed on a second surface of the insulation layer opposite the metal layer. Shortest distances between soldering dots on the metal layer and a projected area of the first solder pad on the metal layer are shorter than a distance threshold, the shortest distance being a minimum value of vertical distances between each of the soldering dots on the metal layer and a side edge of the projected area of the first solder pad on the metal layer. The soldering dots on the metal layer correspond one-to-one to soldering dots on a corresponding die; and the side edge is adjacent to a projected area of the second solder pad on the metal layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.