Heat dissipation device
US11758688B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 16, 2019 |
| Grant date | Sep 12, 2023 |
| Priority date | — |
| Expiry date | May 10, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/3672
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is a heat dissipation device including a base, a plurality of heat pipes and a heat dissipation structure. The base includes a support plate, a plurality of through-pipe grooves are arranged in the support plate. Each heat pipe includes a heat absorption section and a heat transfer section connected to the heat absorption section, where the heat absorption section is arranged in the through-pipe grooves and at least one heat transfer section of the heat pipe is away from the support plate in the perpendicular direction to the support plate. The heat dissipation structure is arranged on the first surface of the support plate, and the heat transfer section of the plurality of heat pipes extends into the interior of the heat dissipation structure and thermally contacts the heat dissipation structure. The heat dissipation device of the present disclosure dissipates heat faster.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.