Heat dissipation module
US11758692B2 · kind B2 · utility
0Cited by
6References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 9, 2021 |
| Grant date | Sep 12, 2023 |
| Priority date | — |
| Expiry date | Mar 9, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/2039
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat dissipation module is provided and includes a cold plate having a housing, and a frame body disposed on the housing and having two sidewalls and at least one first rib, where the two sidewalls are positioned at two sides of the housing, respectively, and the first rib is used to provide a deformation resistance so that the heat dissipation module will not be seriously deformed when secured.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.