Packaging structure, display panel and display device including microstructure layer
US11758756B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 13, 2021 |
| Grant date | Sep 12, 2023 |
| Priority date | — |
| Expiry date | May 27, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K2102/351
Abstract
Provided is a packaging structure, including an inorganic packaging layer and an organic packaging layer that are laminated on a substrate, wherein the organic packaging layer includes a microstructure layer and a planarization layer, a refractive index of the planarization layer being lower than that of the microstructure layer; wherein the microstructure layer includes a base structure on the inorganic packaging layer and a plurality of protrusion structures spaced apart on a surface of the base structure away from the inorganic packaging layer; and the planarization layer fills at least gaps between adjacent protrusion structures, and a side of the planarization layer away from the inorganic packaging layer is of a planar structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.