Filament compositions for fused filament fabrication and methods of use thereof
US11760872B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 12, 2017 |
| Grant date | Sep 19, 2023 |
| Priority date | — |
| Expiry date | Oct 9, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/03
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The disclosure generally relates to filaments and in particular, filaments for use in fused filament fabrication to prepare 3D printed articles. The filaments comprising a polymer composition, said polymer composition comprising: a) about 5 wt. % to about 60 wt. % of a thermoplastic polymer A having a melting peak temperature greater than 40° C.; b) about 95 wt. % to about 40 wt. % of a thermoplastic polymer B having a melting peak temperature greater than 20° C.; c) optionally from about 0.1 to 3 wt. % of a viscosity modifier; wherein: the melting peak temperature of thermoplastic polymer A is at least 20° C. greater than the melting peak temperature of thermoplastic polymer B; thermoplastic polymer A is dispersed in thermoplastic polymer B; and the polymer composition has a melt index of at least 0.1 g/10 minutes using a 10 kg weight measured according to ASTM D1238-13 at a temperature which is less than the melting peak temperature of thermoplastic polymer A and which is greater than the melting peak temperature of thermoplastic polymer B.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.