Sputtering techniques for biosensors
US11761077B2 · kind B2 · utility
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83References
10Claims
0Family size
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Key dates
| Filing date | Aug 1, 2018 |
| Grant date | Sep 19, 2023 |
| Priority date | — |
| Expiry date | Jul 11, 2040 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61B2562/125
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Systems and methods for forming probes for a biosensor. In the systems and methods disclosed herein, a base substrate is provided; and a platinum layer is formed on the base substrate by sputtering platinum in the absence of oxygen. The platinum layer is formed using a sputtering pressure of at least 30 mtorr.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.