Copper electroplating baths containing compounds of reaction products of amines, polyacrylamides and sultones
US11761107B2 · kind B2 · utility
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2Claims
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Key dates
| Filing date | Jan 17, 2020 |
| Grant date | Sep 19, 2023 |
| Priority date | — |
| Expiry date | Dec 12, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D7/12
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Copper electroplating baths include reaction products of amines, polyacrylamides and sultones. The reaction products function as levelers and enable copper electroplating baths which have high throwing power and provide copper deposits with reduced nodules.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.