Terminal material for connector
US11761109B2 · kind B2 · utility
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4Claims
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Assignee
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Key dates
| Filing date | Jan 28, 2021 |
| Grant date | Sep 19, 2023 |
| Priority date | — |
| Expiry date | Jan 28, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R2201/26
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A terminal material for a connector provided with a base material in which at least a surface layer is made of copper or copper alloy, a nickel-plating layer made of nickel or nickel alloy and formed on a surface of the base material, a silver-nickel alloy plating layer made of silver-nickel alloy and formed on at least a part of the nickel-plating layer, and a silver-plating layer made of silver and formed on the silver-nickel alloy plating layer; the silver-nickel alloy plating layer has a film thickness 0.05 µm or more and less than 0.50 µm and a nickel content 0.03 at% or more and 1.00 at% or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.