Two-phase immersion-type heat dissipation structure having fins with different thermal conductivities
US11761719B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 19, 2022 |
| Grant date | Sep 19, 2023 |
| Priority date | — |
| Expiry date | Oct 19, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/208
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A two-phase immersion-type heat dissipation structure having fins with different thermal conductivities is provided. The two-phase immersion-type heat dissipation structure includes a heat dissipation substrate, and a plurality of fins. The heat dissipation substrate has a fin surface and a non-fin surface that face away from each other. The non-fin surface is configured to be in contact with a heating element immersed in a two-phase coolant. The fin surface is connected with the plurality of fins. At least one of the plurality of fins is a functional fin that is made of a single metal material and has two or more thermal conductivities. A thermal conductivity of a lower portion of the functional fin that is connected with the heat dissipation substrate is lower than thermal conductivities of other portions of the functional fin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.