Patent · US Active

Magnetic sensor package

US11761793B2 · kind B2 · utility

0Cited by
10References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMay 21, 2021
Grant dateSep 19, 2023
Priority date
Expiry dateMay 21, 2041

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG01R33/091
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A magnetic sensor package comprising a magnetic multi-turn sensor die and a magnetic single turn sensor die, in which both sensor dies are packaged on the same lead frame. A method of manufacturing the magnetic sensor package is also provided. A magnetic sensor system comprising a rotating magnet and the magnetic sensor package, where the sensor package is arranged so that both sensor dies sit within a homogenous magnetic field, thereby ensuring that the output signal of each sensor is not corrupted by any stray fields.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.