Method of forming structure having coating layer and structure having coating layer
US11764057B2 · kind B2 · utility
1Cited by
4References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 24, 2021 |
| Grant date | Sep 19, 2023 |
| Priority date | — |
| Expiry date | May 24, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02491
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of forming a structure having a coating layer includes the following steps: providing a substrate; coating a fluid on the surface of the substrate, where the fluid includes a carrier and a plurality of silicon-containing nanoparticles; and performing a heating process to remove the carrier and convert the silicon-containing nanoparticles into a silicon-containing layer, a silicide layer, or a stack layer including the silicide layer and the silicon-containing layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.