Tape carrier assemblies having an integrated adhesive film
US11764133B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 13, 2022 |
| Grant date | Sep 19, 2023 |
| Priority date | — |
| Expiry date | Jun 13, 2042 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1097
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Introduced here are carrier tape assemblies that can improve efficiency and reduce costs when utilized in the handling, transport, or storage of semiconductor components. A carrier tape assembly can include an adhesive film affixed to an elongated and/or extruded carrier tape. For example, the adhesive film may be integrally laminated onto the top surface of the elongate carrier tape as a single continuous (i.e., unbroken) sheet. The adhesive film may substantially conform to the top surface of the elongate carrier tape, including any punched cavities for holding semiconductor components. Proper securement of the semiconductor components to the carrier tape assembly depends on the adhesive property of the constituent material(s) of the adhesive film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.