Integration of modulator and laser in a single chip
US11764543B2 · kind B2 · utility
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11References
18Claims
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Key dates
| Filing date | Aug 11, 2020 |
| Grant date | Sep 19, 2023 |
| Priority date | — |
| Expiry date | Aug 23, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/3095
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optoelectronic device includes a substrate and first thin film layers disposed on the substrate and patterned to define a vertical-cavity surface-emitting laser (VCSEL), which is configured to emit optical radiation along an optical axis perpendicular to the substrate. Second thin film layers are disposed over the first thin film layers and are patterned to define an optical modulator in which the optical radiation propagates in a direction parallel to the substrate, and an optical coupler configured to couple the optical radiation from the VCSEL into the optical modulator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.