Support structure for bulk acoustic wave resonator
US11764750B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2019 |
| Grant date | Sep 19, 2023 |
| Priority date | — |
| Expiry date | Jan 4, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H2003/0407
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
Devices and processes for preparing devices are described for a bulk acoustic wave resonator. A stack includes a first electrode that is coupled to a first side of a piezoelectric layer and a second electrode that is coupled to a second side of the piezoelectric layer. The stack is configured to resonate in response to an electrical signal applied between the first electrode and the second electrode. A cavity frame is coupled to the first electrode and to the substrate. The cavity frame forms a perimeter around a cavity. Optionally, a heat dissipating frame is formed and coupled to the second electrode. The cavity frame and/or the heat dissipating frame improve the thermal stability of the bulk acoustic resonator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.