Printed circuit boards with meshed conductive structures
US11765822B1 · kind B1 · utility
0Cited by
8References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 1, 2021 |
| Grant date | Sep 19, 2023 |
| Priority date | — |
| Expiry date | Sep 1, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09681
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Electronic apparatus includes a dielectric substrate and alternating layers of conducting and dielectric materials disposed over the dielectric substrate, including at least first and second patterned layers of the conducting material separated by an intervening layer of the dielectric material. A conductive trace is disposed within the first patterned layer of the conducting material. A conductive mesh extends within the second patterned layer of the conducting material over a region that overlaps transversely with at least a part of the conductive trace in the first patterned layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.