Laminated ceramic sintered body board for electronic device, electronic device, chip resistor, and method for manufacturing chip resistor
US11765824B2 · kind B2 · utility
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10Claims
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Key dates
| Filing date | Jun 24, 2021 |
| Grant date | Sep 19, 2023 |
| Priority date | — |
| Expiry date | Jun 24, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01C17/06526
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A laminated ceramic sintered body board for an electronic device includes a ceramic sintered body board and a flattening film that is provided on an upper surface of the ceramic sintered body board and contains a thermally conductive filler, and the flattening film contains a thermally conductive filler.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.