Right angle sidewall and button interconnects for molded SiPs
US11765838B2 · kind B2 · utility
0Cited by
9References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 20, 2021 |
| Grant date | Sep 19, 2023 |
| Priority date | — |
| Expiry date | Oct 23, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/048
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Electronic modules and methods of fabrication are described. In an embodiment, an electronic module includes a molded system-in-package, and a flexible circuit mounted on a side surface of a molding compound layer such that the flexible circuit is in electrical contact with a lateral interconnect exposed along the side surface of the molding compound layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.