Host electronic device having a movable cooling component for removable electronic device
US11765848B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 29, 2021 |
| Grant date | Sep 19, 2023 |
| Priority date | — |
| Expiry date | Sep 24, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20509
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Example implementations relate to a host electronic device configured for establishing a thermal contact between a heat generating component of a removable electronic device, and a cooling component of the host electronic device, when the removable electronic device is detachably connected to the host electronic device. The host electronic device includes a support structure, the cooling component, a driver, and an actuator. The cooling component is movably connected to the support structure. The driver is also movably connected to the support structure. The actuator is movably connected to the support structure and the driver. The actuator, upon contact by the removable device, causes a movement of the cooling component via the driver for establishing the thermal contact between the cooling component and the heat generating component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.