Automatic soldering processing system and automatic soldering processing method
US11766731B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 7, 2021 |
| Grant date | Sep 26, 2023 |
| Priority date | — |
| Expiry date | Mar 1, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/42
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An automatic soldering processing system is disclosed and includes a soldering-point information obtaining unit, a soldering-parameter generating unit, a solder feeding unit, an iron tip, a motion control unit, and a temperature control unit. The soldering-point information obtaining unit obtains an image of at least one soldering-point of an electronic product, the soldering-parameter generating unit generates soldering parameters such as solder feeding speed, solder feeding amount, moving speed, moving path, heating temperature and heating time for the at least one soldering-point correspondingly according to the image. The solder feeding unit feeds solder based on the solder feeding speed and the solder feeding amount, the iron tip performs a soldering action by using the solder, and the motion control unit and the temperature control unit control the iron tip according to the moving speed, the moving path, the heating temperature, and the heating time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.