Multi-path cooling for robotic systems
US11766787B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 28, 2020 |
| Grant date | Sep 26, 2023 |
| Priority date | — |
| Expiry date | May 16, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20409
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
This application describes multi-path cooling arrangements for robotic systems. For example, a robotic system can include a heat generating component positioned within a base that supports one or more articulating links. The heat generating component can be supported on a thermally conductive bracket within the base. The robotic system can include a first thermally conductive path configured to dissipate heat from the heat generating component. The first thermally conductive path can include the bracket and a first heatsink connected to the bracket. The robotic system can also include a second thermally conductive path configured to dissipate heat from the heat generating component. The second thermally conductive path can include the bracket, a thermal pad positioned on the bracket, and a second heatsink positioned on a second side of the base.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.