UV-curable resin composition enabling thermoforming and replica film of real material comprising same
US11767390B2 · kind B2 · utility
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16Claims
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Key dates
| Filing date | Sep 29, 2020 |
| Grant date | Sep 26, 2023 |
| Priority date | — |
| Expiry date | Oct 15, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2375/06
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present disclosure relates to a UV-curable resin composition enabling thermoforming and a replica film of a real material including the same, in which the UV-curable resin composition includes a prepolymer including a urethane-based oligomer and an acrylic oligomer, an acrylate monomer and a photoinitiator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.