Thermally conductive resin composition
US11767397B2 · kind B2 · utility
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1References
11Claims
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Assignee
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Key dates
| Filing date | Oct 7, 2019 |
| Grant date | Sep 26, 2023 |
| Priority date | — |
| Expiry date | Oct 29, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2203/326
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention aims to provide a resin composition which can form a cured product having a high adhesive property and a high thermal conductivity. A resin composition containing an epoxy compound (A), an amine curing agent (B) and a thermally conductive filler (C), wherein the epoxy compound (A) is in a liquid form and wherein the amine curing agent (B) contains a benzoxazole skeleton.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.