Patent · US Active

Sputter target and method for producing a sputter target

US11767587B2 · kind B2 · utility

0Cited by
2References
14Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 19, 2018
Grant dateSep 26, 2023
Priority date
Expiry dateAug 15, 2038

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC22C32/0073
  • WIPO fieldMaterials, metallurgy
  • WIPO sectorChemistry

Abstract

A target for use in a physical vapor deposition process includes a matrix composed of a composite material selected from the group consisting of aluminum-based material, titanium-based material and chromium-based material and all combinations thereof. The matrix is doped with doping elements and the doping elements are embedded as constituents of ceramic compounds or aluminum alloys in the matrix. The doping elements are selected from the group of the lanthanides: La, Ce, Nb, Sm and Eu. A process for producing such a target and a use of such a target in a physical vapor deposition process are also provided.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.