Cooling arrangement having a closed loop, a semi-open loop and at least one fan
US11768035B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 30, 2022 |
| Grant date | Sep 26, 2023 |
| Priority date | — |
| Expiry date | May 30, 2042 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02B30/54
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
Cooling arrangement and method for cooling of a heat source. The cooling arrangement includes a closed loop, a semi-open loop and at least one fan. The closed loop includes a primary side of a liquid-to-liquid heat exchanger receiving a first cooling fluid heated by the heat source, a first air-to-liquid heat exchanger downstream the primary side, and a first pump returning the first cooling fluid to the heat source. The semi-open loop includes a tank storing a second cooling fluid, a second pump drawing the second cooling fluid from the tank, a secondary side of the liquid-to-liquid heat exchanger receiving the second cooling fluid from the second pump, an evaporating pad downstream said secondary side, and an inlet fluidly connected to a source of the second cooling fluid. The at least one fan causes an air flow through the evaporating pad and through the first air-to-liquid heat exchanger.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.