Packaged current sensor integrated circuit
US11768229B2 · kind B2 · utility
1Cited by
42References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 10, 2022 |
| Grant date | Sep 26, 2023 |
| Priority date | — |
| Expiry date | Mar 10, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R15/205
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A packaged current sensor integrated circuit includes a primary conductor having an input portion and an output portion configured to carry a current to be measured by a magnetic sensing element supported by a semiconductor die adjacent to the primary conductor. The primary current path contains a mechanical locking feature. The thickness of the molded body of the package is reduced to improve vibration immunity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.