Head securement for head-mountable device
US11768518B1 · kind B1 · utility
2Cited by
11References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 9, 2021 |
| Grant date | Sep 26, 2023 |
| Priority date | — |
| Expiry date | Jul 9, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F3/013
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Systems of the present disclosure can provide a head-mountable device with a head securement element that is integrated with a light seal module, which provides effective and comfortable engagement with a face of the user. By providing the head securement element with a light seal module, both head securement and face engagement can be customized or otherwise selected for achieving the desired fit for a given user. Accordingly, the head securement element (e.g., band, arms, and the like) can be primarily or exclusively secured to an HMD module via a light seal module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.