Patent · US Active

High-dimensional multi-distributed importance sampling for circuit yield analysis

US11768986B2 · kind B2 · utility

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6References
16Claims
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Key dates

Filing dateMar 13, 2020
Grant dateSep 26, 2023
Priority date
Expiry dateSep 28, 2040

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG06F2119/22
  • WIPO fieldComputer technology
  • WIPO sectorElectrical engineering

Abstract

A computer-implemented method for simulation of an integrated circuit for yield analysis includes: a) for plurality of variables, generating initial sampling sets by sampling from provided distributions related to physical properties of circuits; b) selecting at least one sample from each initial set randomly and combining into initial simulation set; c) running initial simulation of operation of circuit, applying initial simulation set, the operation having passing/failing criterion; d) if fails: storing samples of initial set into initial sampling distributions for each variable; e) repeating steps b)-d) until sufficient failures obtained; f) building importance sampling distribution based on each initial sampling distribution, the importance distribution having lower, center, upper portions; g) generating secondary simulation set by drawing samples from importance sampling distribution for each variable; h) simulating circuit by applying the secondary set; i) repeating steps g)-h); j) mapping resulting yields to provided distributions, to obtain a yield.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.