Heat transfer module
US11769600B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 3, 2020 |
| Grant date | Sep 26, 2023 |
| Priority date | — |
| Expiry date | Apr 1, 2042 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E30/30
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat transfer module can include an envelope sealed to define an internal volume that contains a working fluid and a wick disposed on an internal surface of the envelope. The wick and envelope each has a first portion extending through an evaporator region and a second portion extending through adiabatic and condenser regions. The first portion of the wick is a metal hydride. The first portion of the envelope includes a metal liner surrounding the first portion of the wick, a first diffusion barrier layer disposed between the first portion of the wick and the metal liner, and a ceramic matrix composite cladding surrounding the metal liner. The second portions of the wick and envelope each includes a refractory metal and/or stainless steel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.