Board having multilayer capacitor mounted thereon and multilayer capacitor package
US11769633B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 16, 2021 |
| Grant date | Sep 26, 2023 |
| Priority date | — |
| Expiry date | Aug 6, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electronic component includes a board having first and second electrode pads on one surface of the board; and a multilayer capacitor. The multilayer capacitor comprises: a capacitor body comprising a dielectric layer and a plurality of internal electrodes, disposed horizontally with respect to a mounting surface of the capacitor body facing the one surface of the board, and external electrodes disposed on both end portions of the capacitor body and connected to exposed portions of the internal electrodes, respectively. The electronic component satisfies Lp/Lc≤1.35, where a distance between outer edges of the first and second electrode pads is defined as Lp, and a length of the multilayer capacitor is defined as Lc.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.