Integrated circuit with integrally formed micro-channel oscillating heat pipe
US11769709B2 · kind B2 · utility
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3References
13Claims
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Key dates
| Filing date | Dec 4, 2017 |
| Grant date | Sep 26, 2023 |
| Priority date | — |
| Expiry date | Dec 4, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/4871
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A miniaturized oscillating heat pipe (OHP) embedded within an integrated circuit (IC) is provided. The miniaturized oscillating heat pipe (OHP) integrally formed within an integrated circuit (IC) is fabricated to form a monolithic IC device using silicon (or similar future semiconductors) fabrication techniques. The OHP is operable to transfer high local heat fluxes within the IC device to more accessible locations on the IC device for heat rejection to an available heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.