Semiconductor device and method for manufacturing the same
US11769744B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 7, 2021 |
| Grant date | Sep 26, 2023 |
| Priority date | — |
| Expiry date | Dec 19, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06593
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a first substrate having a first surface, and a second substrate having a second surface in contact with the first surface. The first substrate includes a first circuit, a first electrode having a first connection end on the first surface, and a first auxiliary electrode having a second connection end on the first surface. The first electrode is connected to the first circuit inside the first substrate, and the first auxiliary electrode is connected to the first electrode. The second substrate includes a second circuit and a second electrode having a third connection end on the second surface. The second electrode is connected to the second circuit. The third connection end is connected directly with the first connection end and the second connection end. The second electrode is connected directly with the first electrode and through the first auxiliary electrode to the first electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.