Chip structure, packaging structure and manufacturing method for chip structure
US11769745B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2021 |
| Grant date | Sep 26, 2023 |
| Priority date | — |
| Expiry date | Nov 11, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/81201
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides a chip structure, a packaging structure and a manufacturing method for the chip structure. The chip structure includes at least one chip body, each of which includes at least one radio frequency front-end device; the chip structure further includes a redistribution layer stacked on the chip body and at least one pin on the redistribution layer; each radio frequency front-end device corresponds to one pin, which is electrically connected to the radio frequency front-end device through an electrical connector extending through the redistribution layer; an extending direction of the radio frequency front-end device is consistent with an extending direction of the pin corresponding to the radio frequency front-end device; a surface of the pin distal to the redistribution layer is a first plane. In the present disclosure, with the first plane, the chip may be directly and electrically connected to a flexible circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.