Process for collectively curving a set of electronic chips

US11769785B2 · kind B2 · utility

Assignee

• COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES · FR

Inventors

• Bertrand Chambion · Chambéry, FR
• Jean-Philippe Colonna · Grenoble, FR

Key dates

• Filing date: Oct 16, 2020
• Grant date: Sep 26, 2023
• Expiry date: Jan 13, 2042

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10F39/811

Abstract

A process includes providing electronic chips, the chips having been diced beforehand and each including a stack including a matrix-array of pixels, an interconnect layer, first layer, joining the electronic chips to a carrier substrate, so as to leave a spacing region between the chips; forming a redistribution layer having lateral ends extending into each spacing region; forming metal pillars on the lateral ends; moulding a material including first segments, facing the first layers, second segments which are separate from the first segments, and which extend around the metal pillars; the first and second segments being coplanar; applying a heat treatment, the formed material being chosen so that the stack is curved with a convex shape; the second segments remaining coplanar at the end.