Systems and methods for mobile molding and bonding
US11771971B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 8, 2020 |
| Grant date | Oct 3, 2023 |
| Priority date | — |
| Expiry date | Jan 16, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2605/003
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A mobile molding system, comprising a vehicle and one or more molds arranged on the vehicle configured for receiving one or more expandable nonwoven substrates, heating said one or more expandable nonwoven substrates so as to cause said one or more expandable nonwoven substrates to expand and fill the one or more molds with one or more expanded nonwoven containing articles of three dimensional shape, and releasing said one or more expanded nonwoven containing articles of three dimensional shape from the one or more molds is provided. Methods for manufacturing three dimensional objects using the mobile molding system are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.