Multi-slot die coater with improved manifold
US11772119B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 25, 2021 |
| Grant date | Oct 3, 2023 |
| Priority date | — |
| Expiry date | Aug 25, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/10
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
There is provided a multi-slot die coater including a manifold for a uniform flow of an electrode active material slurry without stagnation. The multi-slot die coater of the present disclosure includes a first manifold in which a first coating solution is received and a second manifold in which a second coating solution is received. The first manifold is a chamber of an inwardly recessed shape, and includes a first surface and a second surface having different angles to a lower slot at a location close to the lower slot, and the angle of the first surface closest to the lower slot is formed at a level of 30˜70% of the second surface following the first surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.