Multi-layer contact plate and method thereof
US11772178B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 8, 2020 |
| Grant date | Oct 3, 2023 |
| Priority date | — |
| Expiry date | May 8, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An embodiment of the disclosure is directed to a multi-layer contact plate configured to establish electrical bonds to battery cells in a battery module, comprising a first plate section configured with a first set of raised dimples on an inner side of the first plate section, a second plate section configured with a second set of raised dimples on an inner side of the second plate section, a cell terminal connection layer sandwiched between the first and second plate sections, wherein a portion of the cell terminal connection layer is configured to form a set of bonding connectors to provide a direct electrical bond between the multi-layer contact plate and terminals of at least one group of battery cells, and a set of inter-layer connection points arranged between at least the first and second plate sections, each of the set of inter-layer connection points being arranged where raised dimples on the first and second plate sections are aligned with each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.