Tunable system and method for stress resolution in additive manufacturing
US11772330B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 12, 2020 |
| Grant date | Oct 3, 2023 |
| Priority date | — |
| Expiry date | May 31, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Prior to manufacturing a product by additive manufacturing, a stress relief profile including frequency and amplitude parameters of an ultrasonic input is determined based on physical properties of the product, including resonant frequencies of the product and a material from which the product is manufactured. Successive layers of a material are added and energy is applied to incorporate the material of each layer into the product. A processor accesses stress relief profile parameters for each layer, determines whether a layer requires stress relief and determines a frequency and a power level for the stress relief at the layer. An ultrasonic input is applied with the determined parameters to relieve stress as the product is built up.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.