Thermal print head
US11772388B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 25, 2020 |
| Grant date | Oct 3, 2023 |
| Priority date | — |
| Expiry date | Oct 8, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/3355
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A thermal print head includes a heat-generating substrate, a resistor layer, a conductive layer, a first substrate, a second substrate, and a third substrate. The heat-generating substrate includes a heat-generating substrate obverse face and a heat-generating substrate reverse face that are spaced apart from each other in a thickness direction. The resistor layer is supported by the heat-generating substrate. The conductive layer is supported by the heat-generating substrate, and electrically connected to the resistor layer. The first substrate is located upstream of the heat-generating substrate in a sub-scanning direction. The second substrate is located upstream of the first substrate in the sub-scanning direction. The third substrate is bonded to the first substrate and the second substrate and higher in flexibility than the first substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.