Laser cutting and processing of display glass compositions

US11773004B2 · kind B2 · utility

Assignee

• CORNING INCORPORATED · US

Inventors

• Thomas Hackert · Germering, DE
• Xinghua Li · Corning, US
• Sasha Marjanovic · Corning, US
• Moussa N'Gom · Ypsilanti, US
• David Andrew Pastel · Horseheads, US
• Garrett Andrew Piech · Corning, US
• Daniel Schnitzler · Bedburg, DE
• Robert Stephen Wagner · Corning, US
• James J. Watkins · South Hadley, US

Key dates

• Filing date: Mar 23, 2016
• Grant date: Oct 3, 2023
• Expiry date: Mar 23, 2036

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02P40/57
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

The present invention relates to a laser cutting technology for cutting and separating thin substrates of transparent materials, for example to cutting of display glass compositions mainly used for production of Thin Film Transistors (TFT) devices. The described laser process can be used to make straight cuts, for example at a speed of >0.25 m/sec, to cut sharp radii outer corners (<1 mm), and to create arbitrary curved shapes including forming interior holes and slots. A method of laser processing an alkaline earth boro-aluminosilicate glass composite workpiece includes focusing a pulsed laser beam into a focal line. The pulsed laser produces pulse bursts with 5-20 pulses per pulse burst and pulse burst energy of 300-600 micro Joules per burst. The focal line is directed into the glass composite workpiece, generating induced absorption within the material. The workpiece and the laser beam are translated relative to each other to form a plurality of defect lines along a contour, with adjacent defect lines have a spacing of 5-15 microns.