Glass assembly including a conductive feature and method of manufacturing thereof
US11773011B1 · kind B1 · utility
0Cited by
36References
19Claims
0Family size
Assignee
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Key dates
| Filing date | Jul 8, 2022 |
| Grant date | Oct 3, 2023 |
| Priority date | — |
| Expiry date | Jul 8, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B2203/017
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of manufacturing a glass assembly to have a conductive feature includes a step of forming a glass substrate that is curved. The method also includes digitally-applying a conductive ink without a mask onto a surface of the curved glass substrate. The method further includes curing the conductive ink to form the conductive feature on the surface of the curved glass substrate, with the conductive feature having a resolution of greater than 200 dots per inch.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.