Compound for enhancing adhesion properties of polyimide resin and polyimide copolymer produced using same
US11773117B2 · kind B2 · utility
0Cited by
4References
13Claims
0Family size
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Key dates
| Filing date | Jun 27, 2018 |
| Grant date | Oct 3, 2023 |
| Priority date | — |
| Expiry date | Oct 14, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2203/16
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention provides a novel polyimide resin adhesion enhancer having a fluorene framework, wherein a polyimide film produced using same exhibits conventional properties such as heat resistance and mechanical properties, and maintains adhesion with a carrier substrate while not being affected with respect to retardation even during a high-temperature process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.