Cured epoxy resin composition suitable for electronic device enclosure, articles, and methods
US11773254B2 · kind B2 · utility
0Cited by
7References
33Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2018 |
| Grant date | Oct 3, 2023 |
| Priority date | — |
| Expiry date | Jan 17, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2201/009
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An electronic device is described comprising an enclosure, wherein the enclosure comprises a cured epoxy resin composition comprising at least 50 volume % of electrically non-conductive thermally conductive inorganic particles, wherein the inorganic particles are selected from alumina, boron nitride, silicon carbide, alumina trihydrate and mixtures thereof. The enclosure may be a housing of a phone, laptop, or mouse. Alternatively, the enclosure may be a case for an electronic device. Also described are epoxy resin compositions and a method of making an enclosure for an electronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.