Method for adhesively bonding rubber-based thermoplastic substrates
US11773294B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 19, 2020 |
| Grant date | Oct 3, 2023 |
| Priority date | — |
| Expiry date | Dec 16, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2475/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for adhesively bonding two substrates by means of a moisture-curable adhesive composition, wherein at least one of the substrates includes at least 40 wt.-% of a mixture, said mixture consisting of: between 15 and 99 wt.-% of at least one thermoplastic polymer; between 1 and 85 wt.-% of at least one elastomer; and wherein the moisture-curable adhesive composition includes: at least one polymer containing silane groups; between 10 and 40 wt.-% of at least one polymeric plasticizer; between 0.1 and 5 wt.-% of at least one amino-functional alkoxysilane; between 0 and 5 wt.-% of at least one C1-C12-alkyl-functional alkoxysilane. The method yields adhesively bonded substrates without the requirements of using migrating plasticizers and pre-treating of the substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.