Heat transferring device and method for making thereof
US11774183B2 · kind B2 · utility
0Cited by
2References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 1, 2021 |
| Grant date | Oct 3, 2023 |
| Priority date | — |
| Expiry date | Sep 15, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02T50/60
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
The present invention provides a heat transferring device and a method for making thereof. The heat transferring device has a thermal conducting substrate and a porous layer. The thermal conducting substrate has a plurality of protrusions and concave bottom surfaces. The concave bottom surfaces are located between the protrusions. The porous layer is embedded between the protrusions. The present invention also provides a high temperature material transferring system comprising a cylindrical container and the heat transferring device disposed on the surface of the cylindrical container.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.