Patent · US Active

Flexible method and apparatus for thickness measurement

US11774230B2 · kind B2 · utility

0Cited by

5References

1Claims

0Family size

Assignee

Yantai University · CN

Inventors

Shuying Qu · Yantai, CN
Jianglong WU · Shandong, CN
Yang Lu · Boise, US

Key dates

Filing date	Aug 25, 2020
Grant date	Oct 3, 2023
Priority date	—
Expiry date	Jul 18, 2042

Classification

Technology area (CPC G)Physics
CPC primaryG01B7/18
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

The present invention discloses a flexible method and apparatus for thickness measurement. The apparatus includes seven parts: a measurement host, an etalon, a tested piece, a test piece positioning support, a driver, and a digital controller. The measurement host includes a rack, a coding lead screw, and a dual-acting cantilever sensor. The coding lead screw includes a micro-metering lead screw and a tri-state encoder. The tri-state encoder includes a fluted disc and four pairs of cantilever sensors. The dual-acting cantilever sensor includes left and right mobile cantilever sensors with a pair of clipping pin. The digital controller contains system measurement software.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.