Estimating a location of an object in close proximity to an ultrasonic transducer
US11774585B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 26, 2021 |
| Grant date | Oct 3, 2023 |
| Priority date | — |
| Expiry date | Jan 13, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01S7/527
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A device comprises a processor coupled with an ultrasonic transducer coupled which is configured to emit an ultrasonic pulse and receive returned signals received after a ringdown period of the transducer and corresponding to the emitted ultrasonic pulse. The processor is configured to evaluate the returned signals to find a candidate echo, from an object located in a ringdown blind spot area, in a time window between one and two times the ringdown period; locate multiple echoes from the object of higher order than the candidate echo; validate the candidate echo as at least a secondary echo associated of the object; and determine, based on analysis of the returned signals, an estimated distance from the transducer to the object in the ringdown blind spot area, wherein the ringdown blind spot area is located between the transducer and a closest distance at which objects can be sensed by the transducer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.