Patent · US Active

Photonic component and method for production thereof

US11774688B2 · kind B2 · utility

0Cited by

4References

7Claims

0Family size

Assignee

SICOYA GMBH · DE

Inventors

Stefan Meister · Berlin, DE
Moritz Grehn · Berlin, DE
Sven Otte · Hohen Neuendorf, DE
Sebastian Höll · Roth, DE

Key dates

Filing date	Jan 29, 2021
Grant date	Oct 3, 2023
Priority date	—
Expiry date	Jan 29, 2041

Classification

Technology area (CPC G)Physics
CPC primaryG02B6/4231
WIPO fieldOptics
WIPO sectorInstruments

Abstract

A photonic component having a photonically integrated chip and a fibre mounting, wherein the fibre mounting has: at least one groove, into which an optical fibre is placed, and at least one mirror surface, which reflects radiation from the fibre in the direction of the photonically integrated chip and/or reflects radiation from the photonically integrated chip in the direction of the fibre. A chip stack comprising at least two chips is arranged between the photonically integrated chip and the fibre mounting, the chip stack has at least two through holes and in each case a guide pin, which positions the chip stack and the fibre mounting relative to one another, passes through the at least two through holes of the chip stack.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.