Optical transceiver modules and heat management techniques therefor
US11774693B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 4, 2021 |
| Grant date | Oct 3, 2023 |
| Priority date | — |
| Expiry date | Jun 4, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20418
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An I/O connector includes a body comprising a first surface, a second surface, side surfaces extending between the first surface and the second surface, and a cable entrance port at a rear end of the body extending toward a front end of the body. The I/O connector includes a printed circuit board (PCB) positioned between the first surface and the second surface of the body. The PCB includes a first set of one or more electrical components mounted on a first side of the PCB. A first heatsink is disposed on the first surface. The I/O connector includes first heatpipe thermally coupled with the first heatsink and the first set of one or more electrical components, positioned between the first surface and the first side of the PCB.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.