Apparatus, control method and control device of semiconductor packaging
US11774935B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 8, 2016 |
| Grant date | Oct 3, 2023 |
| Priority date | — |
| Expiry date | Aug 29, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/7592
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
In one aspect of the invention, a semiconductor packaging apparatus is provided and comprises: a bonding device for bonding a component to a substrate; a motor for driving the bonding device to operate according to a predetermined motion trajectory; a position sensor for detecting a position of the bonding device at a specific time point and generating a position signal; a motion control unit comprising a path planner for generating a position-time command for the bonding device according to a bonding process requirement, the motion control unit being configured to enable the path planner to update the position-time command based on a touch information between the component and the substrate. In a further aspect of the invention, a control algorithm for the semiconductor packaging apparatus to identify and generate the touch information is also provided, and the process control flow is optimized using the touch information.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.