Biometric sensor module for a smart card and method for manufacturing such a module
US11775794B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 16, 2020 |
| Grant date | Oct 3, 2023 |
| Priority date | — |
| Expiry date | May 18, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06V40/1306
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Biometric sensor module for a chip card, and method for producing such a module Method for producing a biometric sensor module for a chip card, including steps of providing a dielectric carrier including a front face and a back face, the front face being coated with an electrically conductive layer in which a bezel is formed, at least one conductive via being made in the thickness of the carrier to electrically connect the bezel to the back face, producing a protective layer on the front face, covering a protection area located inside the bezel, and attaching a biometric sensor for detecting fingerprints to the back face, a detection area covered by the sensor on the back face being placed opposite the protection area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.